It generates extremely small amount of outgas under high vacuum, minimizing adverse effects on components and semiconductor elements.
- Low outgassing
We realized ultra-low outgassing product by carefully selecting the reactive diluent, curing agent, additive and mixing ration of main agent / curing agent.
- Excellent adhesion property
The product shows good adhesion to all adherends such as aluminum, FR-4 and steel plates.
Contact us to find out how our advanced engineering solutions can help your business