Electronic adhesives




It generates extremely small amount of outgas under high vacuum, minimizing adverse effects on components and semiconductor elements.

  • Low outgassing
    We realized ultra-low outgassing product by carefully selecting the reactive diluent, curing agent, additive and mixing ration of main agent / curing agent.
  • Excellent adhesion property
    The product shows good adhesion to all adherends such as aluminum, FR-4 and steel plates.


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